Quality is our way of life. Our mission is to provide the best value in PCB industry through competitive pricing, highest quality and superior customer service. We work with high quality manufacturing facilities globally to optimize your quality, lead time and cost.
We at BPL PCB consider Quality as the most important part of what we deliver! Our manufacturing processes ensure guarantee against any potential imperfections of PCBs. The Quality Policy is established and structured to provide ISO 9001:2015-compliant quality management. Our quality management system is designed to provide satisfaction for our customers with defect-free products that conform to their requirements and are delivered on time. We invite you to experience our inhouse capabilities to engineer, optimise and deliver your products with a combined knowledge, innovation, efficiencies from art-to-part.
BPL Ltd will consistently provide Printed Circuit Boards that meet or exceed the requirements and expectations of our customers, other interested parties and applicable legal requirements. We will be continually improving Quality, Performance, Reliability and Safety through programmes that enable each employee to do their job right the first time and every time.
| Item | Test Description | Test Conditions | Samples | Test Specimens | Acceptance Criteria |
|---|---|---|---|---|---|
| 1 | REFLOW | Preconditions: Bake 125+5/-0 deg C 24hrs + 52hr, 60 deg C/60% RH. Reflow profile B of 080-1561. Test Interval: Every 5X. | 32 pieces per lot NPI. 1% per lot or 32 pieces per lot MP whichever is less (max lot size to be 120 panels). | PCB | All 32 pieces pass 4W with < 10% resistance change on worst net @ 20X. Cross Section shows no sign of micro crack or delamination. |
| 2 | HOT OIL TEST | Preconditions: Bake 125+5/-0 deg C 24hrs + 52hr, 60 deg C/60% RH. Test Interval: Continuous monitoring. | 32 pieces per lot | Daisy Chain Coupon (Min via-10um diminishing concept, ODB++ pad & pitch size) | All 32 pieces pass 50 cycles @ 260 deg C with <5% change in resistance (Initial Resistance-Highest/Lowest Resistance during continuous operation). Cross section shows no sign of blisters and delamination. |
| 3 | THERMAL CYCLE | Preconditions: Bake 125+5/-0 deg C 24hrs + 52hr, 60 deg C/60% RH. Test Interval: Continuous Monitoring. | 10 pieces per lot + 10 pieces of coupon per lot | PCB and Daisy Chain Coupon (Min via-10um, ODB++ pad & pitch size) | All 10+10 pieces pass 750 cycles @-55 to 125 deg C with <10% change in resistance (Initial Resistance-Highest/Lowest Resistance during continuous operation). Class 3 to be applied. Copper voids are not acceptable. |
| 4 | INSULATION RESISTANCE/bHAST (Via/Via, Trace/Trace, Layer/Layer).==> CAF | Test Interval: 25, 50, 75, 100…225, 250 hr Continuous Monitoring. | line-to-line, hole-to-hole, layer-to-layer coupons 10 coupon each, 30 total | Coupon (Min via-10um, ODB++pad & pitch size) | All 10 pieces pass 110 deg C, 85% RH, 122kPa, 20V bias voltage, 100 hours with no sign of blisters/delamination & cap at 100MOhm. |
| 5 | IONIC CONTAMINATION | IPC-TM-650 2.3.25 | 5 pieces per lot | PCB | < 4.5 ugNacl/sq.in |
| 6 | SOLDER MASK/PLATING ADHHESION | IPC-TM-2.4.28.1/2.4.1.3M Scotch #650 or equivalent. 13mm wide and 51mm length | 5 pieces per lot @ 3 separate areas (smallest pitch BGAs) | PCB | No sign of peeling |
| 7 | CHEMICAL RESISTANCE | IPC-TM-650 2.3.42 (Use IPA) | 5 pieces per lot | PCB | No degradation ( surface roughness, blisters, delamination, swelling or color change when exposed to chemicals ) |
| 8 | SOLDER MASK HARDNESS | IPC-TM-650 2.4.27.1 & 2.4.27.2 Class 3 | 5 pieces per lot | PCB | > 6H |
| 9 | DIELECRIC WITHSTANDING | MIL-PRF-31032, IPC TM-650 2.5.7 Condition A | 5 pieces per lot | PCB | No breakdown or spark Test nets with smallest spacing |
| 10 | SOLDERABILITY TEST | J-STD-003 | 5 pieces per lot per each solder type | PCB | > 95% coverage ( Both LTS-Alpha CVP 520 and HTS-Alpha OM 340 Solder Paste via Stencil Reflow ) for all project. Stencil bottom thickness in accordance to project requirement. Stencil aperture per ODB++ |
| 11 | MOISTURE ABSORPTION | IPC-TM-650 2.6.2.1 | 5 pieces per lot | PCB | < 0.8% |
| 12 | FLUX RESISTANCE | Per 099-01674 | 5 pieces per lot | PCB | No degradation, peeling, blistering |
| 13 | THERMAL STABILITY | Solder bath Dip at 274 deg C for 10 seconds - 6 times shock | 5 pieces per lot | PCB | No burning, blistering, delamination or color change |
| 14 | COPPER ELONGATION | IPC-TM-650 2.4.18 | To be performed on all test tank. | PCB | > 20% all measurements to be provided, and not just average |
| 15 | PEEL STRENGTH TESTER | IPC-2.4.9 TM 650 | Specimen Size depends on Regid and flex laminates. | Sheet and PCB | To check the Peel strength of the Laminate in Sheet level and also on PCB. |
| 16 | XRF Metal Analyzer | To Check chek the Metal thickness on surface. | PCB | Different Surafce finish Thickness can be Measured. |
Every order, regardless of size, receives the utmost attention to detail throughout the entire process to ensure all customer expectations are met.
It all starts with the customers expectations and specifications. Every order is produced within the strict guidelines set forth by our customers.
Our ISO 9001 certification means that BPL has put in the necessary framework to ensure consistency is achieved and the quality standards are met within our organization.